Bluetooth Earphone PCB — 8L 2-Step, ENIG | Superb Automation
8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber
Tag: stacked via
HDI PCB Design Guide: Micro-Vias, Any-Layer & High-Density Routing
High-Density Interconnect (HDI) PCB technology uses laser-drilled micro-vias — typically 0.1–0.15 mm in diameter — to connect layers at far higher density than traditional through-hole vias. Originally developed for smartphone miniaturization, HDI is